自動焊錫機工作的三個流程：

Three processes for automatic soldering machine operation:

1、潤濕：潤濕過程是指已經熔化了的焊料借助毛細管力沿著母材金屬表面細微的凹凸和結晶的間隙向四周漫流，從而在被焊母材表面形成附著層，使焊料與母材金屬的原子相互接近，達到原子引力起作用的距離。

1, wetting: wetting process refers to the gap has melted solder bump and crystallization by capillary force along the surface of the base metal of the fine to the surrounding flow, resulting in the materials to be welded is formed on the surface of the adhesive layer, the solder and base metal atoms close to each other, to the atomic gravity effect distance.

引起潤濕的環境條件：被焊母材的表面必須是清潔的，不能有氧化物或污染物。

Environmental conditions causing wetting: the surface of the welded base metal must be clean and free from oxides or contaminants.

2、擴散：伴隨著潤濕的進行，焊料與母材金屬原子間的相互擴散現象開始發生。通常原子在晶格點陣中處于熱振動狀態，一旦溫度升高。原子活動加劇，使熔化的焊料與母材中的原子相互越過接觸面進入對方的晶格點陣，原子的移動速度與數量決定于加熱的溫度與時間。

2. Diffusion: as the wetting proceeds, the interdiffusion between solder and base metal atoms begins to occur. Typically, atoms are in thermal vibrational states in lattice lattices, once the temperature is raised. As the atomic activity intensifies, the molten solder and the atoms in the parent material cross each other into the lattice of each other, and the speed and number of atoms are determined by the temperature and time of the heating.

3、冶金結合：由于焊料與母材相互擴散，在2種金屬之間形成了一個中間層---金屬化合物，要獲得良好的焊點，被焊母材與焊料之間必須形成金屬化合物，從而使母材達到牢固的冶金結合狀態。

3, metallurgy combination: because solder and base metal interdiffusion between the 2 metals in the formation of a middle layer - metal compound, to obtain good solder joint, is welded between the base metal and solder must form a metal compound, so that the base material to achieve a combination of state firm metallurgy.